Epoxy resin adhesive for medical device and cured product of the same, and medical device member and medical device
AssigneeFUJIFILM Corporation
InventorsKazushi Furukawa, Yoshihiro Nakai
Life of this patent
Estimating the term…
Abstract
Provided are an epoxy resin adhesive for a medical device and its cured product, and a medical device member and a medical device. The epoxy resin adhesive includes the following components (A) to (C): (A) an epoxy resin; (B) a polyamine compound having two or more unsubstituted amino groups; and (C) a compound having a nonaromatic carbon-carbon double bond group and a phenolic hydroxy group.
Claims12
An epoxy resin adhesive for a medical device, the epoxy resin adhesive comprising the following components (A) to (D):
- (A) an epoxy resin;
- (B) a polyamine compound having two or more unsubstituted amino groups;
- (C) a compound having a nonaromatic carbon-carbon double bond group and a phenolic hydroxy group;
- and
- (D) mineral fillers having a volume-average particle diameter of 6 nm to 500 nm, wherein an amount of the component (D) in the epoxy resin adhesive is in a range of 4% to 20% by mass.
A medical device member comprising a metal substrate and a cured product on the metal substrate, wherein the cured product is obtained by curing an epoxy resin adhesive comprising the following components (A) to (D):
- (A) an epoxy resin;
- (B) a polyamine compound having two or more unsubstituted amino groups;
- (C) a compound having a nonaromatic carbon-carbon double bond group and a phenolic hydroxy group;
- and
- (D) mineral fillers having a volume-average particle diameter of 6 nm to 500 nm, wherein an amount of the component (D) in the epoxy resin adhesive is in a range of 4% to 20% by mass.
A medical device comprising a constituent member secured with a cured product, wherein the cured product is obtained by curing an epoxy resin adhesive comprising the following components (A) to (D):
- (A) an epoxy resin;
- (B) a polyamine compound having two or more unsubstituted amino groups;
- (C) a compound having a nonaromatic carbon-carbon double bond group and a phenolic hydroxy group;
- and
- (D) mineral fillers having a volume-average particle diameter of 6 nm to 500 nm, wherein an amount of the component (D) in the epoxy resin adhesive is in a range of 4% to 20% by mass.
Dependencies are inferred from the claim text.