Compositions containing thermally conductive fillers

A composition, comprising:

• a thiol-terminated compound;
• an oxidant;
• and
• a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles, the thermally conductive, electrically insulative filler particles having a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω·m (measured according to ASTM D257),
• wherein the thermally conductive, electrically insulative filler particles are present in an amount of at least 50% by volume based on total volume of the filler package, wherein the filler package further comprises thermally conductive, electrically conductive filler particles having a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of less than 1 Ohm·m (measured according to ASTM D257, C611, or B193), the thermally conductive, electrically conductive filler particles being present in an amount of no more than 30% by volume based on total volume of the filler package and/or non-thermally conductive, electrically insulative filler particles having a thermal conductivity of less than 5 W/mK (measured according to ASTM D7984) and a volume resistivity of at least 1 Ohm·m (measured according to ASTM D257, C611, or B193), the non-thermally conductive, electrically conductive filler particles being present in an amount of no more than 10% by volume based on total volume of the filler package.