Thermoplastic resin composition and molded product using same
AssigneeLotte Chemical Corporation
InventorsYun Seok Bae, Hyun Je Lee, Kyun Ha Ban, Young Sub Jin
Life of this patent
Estimating the term…
Abstract
The present invention relates to a thermoplastic resin composition and a molded product using same, the thermoplastic resin composition comprising (F) 0.2-3 parts by weight of a polyamide-based flow enhancer on the basis of 100 parts by weight of a basic composition, which comprises: (A) 40-60 wt % of a polyamide resin; (B) 15-30 wt % of an acrylonitrile-butadiene-styrene copolymer resin having a rubber polymer average diameter of 1,000-5,000 nm; (C) 5-10 wt % of an ethylene-based copolymer containing an acid anhydride group; (D) 2-8 wt % of a maleimide-based copolymer; and (E) 10-30 wt % of a carbon fiber.
Claims13
A thermoplastic resin composition comprising:
- 100 parts by weight of a base composition comprising 40 wt % to 60 wt % of (A) a polyamide resin, 15 wt % to 30 wt % of (B) an acrylonitrile-butadiene-styrene copolymer resin containing a rubber polymer having an average particle diameter of 1,000 nm to 5,000 nm, 5 wt % to 10 wt % of (C) an acid anhydride-containing ethylene-based copolymer, 2 wt % to 8 wt % of (D) a maleimide-based copolymer, and 10 wt % to 30 wt % of (E) carbon fibers;
- and
- 0.2 to 3 parts by weight of (F) a polyamide-based fluidity-enhancing agent.
Dependencies are inferred from the claim text.