Metallized polypropylene film
AssigneeOji Holdings Corporation
InventorsShigeru Suzuki, Yoshikazu Fujishiro, Kazuyuki Hiate, Yoshimune Okuyama, Masahiro Nakata, Tadakazu Ishiwata, Toshitsugu Takagaki
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Abstract
Provided is a metallized polypropylene film having excellent insulation breakdown resistance properties. The metallized polypropylene film of the present invention has a thickness of 0.5 to 4.0 μm and has a feature such that the number of insulation breakdown points multiplied by thickness, as determined under predetermined measurement conditions for measuring the number of insulation breakdown points, is 1.90 (points/cm2)·μm or less.
Claims7
A metallized polypropylene film comprising a polypropylene film and a metal layer stacked on one or both surfaces of the polypropylene film, the metallized polypropylene film having a cumulative insulation breakdown point density of 1000 points/m2 or less after a cumulative DC voltage application test is performed by applying a stepwise-increased voltage in the range of 350 to 425 V/μm at 20° C., wherein the polypropylene film is treated at a voltage speed ratio per unit width of a cooling roll of 0.20 V min/m2 or more and 0.45 V min/m2 or less and at an electrical discharge amount of 1.5 W min/m2 or more and 3.7 W min/m2 or less.
Dependencies are inferred from the claim text.