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US 12,629,872 B2Granted
Resin mold
AssigneeMitsubishi Electric Corporation
InventorsYasuyuki Harui, Ryuki Nakamura
Life of this patent
Estimating the term…
Abstract
A resin molding mold of the present disclosure includes: a slide core slidably attached to a guide rail; and a sensor for detecting a force applied to the guide rail when the slide core slides.
Claims6
A resin molding mold comprising”
- a first die and second die
- a slide core supported by the second die and slidably attached to a guide rail of the second die;
- and
- a sensor for detecting a force applied to the guide rail in a direction toward the first die when the slide core slides along the guide rail.
1 more element
Dependencies are inferred from the claim text.