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US 12,629,792 B2Granted
Polishing pad and method for producing polished product
AssigneeFujibo Holdings, Inc.
InventorsTeppei Tateno, Ryuma Matsuoka, Hiroshi Kurihara, Satsuki Yamaguchi, Yamato Takamizawa
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Abstract
A polishing pad including a polyurethane sheet as a polishing layer, wherein the polyurethane sheet has a ratio (E′B40/E′T40) of a storage elastic modulus E′B40 at 40° C. in dynamic viscoelasticity measurement performed under a bending mode condition with a frequency of 1.6 Hz to a storage elastic modulus E′T40 at 40° C. in dynamic viscoelasticity measurement performed under a tension mode condition with a frequency of 1.6 Hz of 0.60 to 1.60.
Claims7
A polishing pad comprising a polyurethane sheet as a polishing layer,
- wherein the polyurethane sheet has a ratio (E′B40/E′T40) of a storage elastic modulus E′B40 at 40° C. in dynamic viscoelasticity measurement performed under a bending mode condition with a frequency of 1.6 Hz to a storage elastic modulus E′T40 at 40° C. in dynamic viscoelasticity measurement performed under a tension mode condition with a frequency of 1.6 Hz of 0.60 to 1.60.
Dependencies are inferred from the claim text.