Method and single wafer processing system for processing of semiconductor wafers

A method for processing a semiconductor wafer, the method comprising:

• inserting the semiconductor wafer into a processing space between a bottom plate having portions defining a lower working surface and a top plate having portions defining an upper working surface of an enclosed chamber;
• supporting the semiconductor wafer substantially parallel to the upper and lower working surfaces;
• and
• processing at least one surface of the semiconductor wafer by:
• injecting at least one processing fluid into the processing space through at least one opening in either the top plate, the bottom plate, or both the top plate and the bottom plate;
• forcing the at least one processing fluid over at least one surface of the semiconductor wafer;
• and
• directing the at least one processing fluid from the processing space through a drainage system having a U-shaped conduit downstream from the processing space, wherein said directing retains a portion of the at least one processing fluid within the U-shaped conduit to provide a pressure resistance against the at least one processing fluid injected into the processing space;
• and
• draining the at least one processing fluid through the U-shaped conduit from an outlet of the U-shaped conduit, the outlet being arranged below the processing space,
• wherein said directing retains a portion of the liquid within the U-shaped conduit to provide a pressure resistance against the liquid injected into the processing space, and wherein the pressure resistance provides a uniform fluid velocity of the liquid radially across the at least one surface of the semiconductor wafer.