Semiconductor device

A semiconductor device comprising:

• a first chip mounting portion;
• a second chip mounting portion;
• a first semiconductor chip mounted on the first chip mounting portion;
• a second semiconductor chip mounted on the second chip mounting portion;
• a third semiconductor chip mounted on the first chip mounting portion and having a plurality of transformers;
• and
• a sealing body sealing the first semiconductor chip, the second semiconductor chip, the third semiconductor chip, the first chip mounting portion and the second chip mounting portion,
• wherein each of the plurality of transformers has a primary coil and a secondary coil that are magnetically coupled to each other,
• wherein the first chip mounting portion and the second chip mounting portion are adjacent to each other in a first direction,
• wherein the first semiconductor chip and the third semiconductor chip are adjacent to each other in a second direction that is perpendicular to the first direction,
• wherein, in plan view, the third semiconductor chip has:
• a third side facing a first side of the first semiconductor chip;
• and
• a fourth side facing a second side of the second semiconductor chip,
• wherein, in plan view, the plurality of transformers is arranged along the third side of the third semiconductor chip,
• wherein the first semiconductor chip has:
• a plurality of first transmitting pads electrically connected with a first transmitting circuit formed in the first semiconductor chip;
• and
• a plurality of first receiving pads electrically connected with a first receiving circuit formed in the first semiconductor chip,
• wherein the second semiconductor chip has:
• a plurality of second transmitting pads electrically connected with a second transmitting circuit formed in the second semiconductor chip;
• and
• a plurality of second receiving pads electrically connected with a second receiving circuit formed in the second semiconductor chip,
• wherein the plurality of transformers of the third semiconductor chip has:
• at least one or more first transformers used to transmit a signal from the first semiconductor chip to the second semiconductor chip;
• and
• at least one or more second transformers used to transmit a signal from the second semiconductor chip to the first semiconductor chip,
• wherein the primary coil of the one or more first transformers is electrically connected with the plurality of first transmitting pads of the first semiconductor chip,
• wherein the secondary coil of the one or more first transformers is electrically connected with the plurality of second receiving pads of the second semiconductor chip,
• wherein the primary coil of the one or more second transformers is electrically connected with the plurality of second transmitting pads of the second semiconductor chip,
• wherein the secondary coil of the one or more second transformers is electrically connected with the plurality of first receiving pads of the first semiconductor chip,
• wherein, in plan view, the one or more second transformers are arranged closer to the second semiconductor chip than the one or more first transformers, and
• wherein, in plan view, the plurality of second transmitting pads is arranged closer to the first semiconductor chip than the plurality of second receiving pads.