Frame mask for singulating wafers by plasma etching

A frame mask for plasma dicing wafers comprising:

• a mask frame, wherein the mask frame includes
• a top ring mask support,
• a side ring mask support,
• a bottom ring mask support;
• a plurality of mask segments suspended from the top ring mask support by segment supports, the segment supports connect the mask segments to the top ring mask support, the mask segments are disposed along first and second orthogonal directions to form a grid pattern, wherein spaces between the mask segments define dicing channels on a blank wafer in the first and second orthogonal directions, wherein the mask segments include a top and a bottom major mask segment surfaces with side mask segment surfaces, the top major mask segment surface is smaller than the bottom major mask segment surface, the side mask segment surfaces have an outwardly sloped profile;
• a cap layer disposed on the bottom major mask segment surface of the mask segments;
• and
• wherein
• the frame mask is configured to removably sit onto a frame lift assembly in a plasma chamber of a plasma dicing tool, when fitted onto the frame lift assembly, the mask segments are disposed above a wafer on a wafer ring frame for plasma dicing, and
• the mask frame is configured to enable flow of plasma therethrough to the wafer to dice the wafer along dicing channels defined by the spaces between the mask segments, and
• the mask frame, including the mask segments, is not eroded by the flow of plasma used in dicing the wafer.