Quantum device comprising first connection portions within deformation suppression region defined by second connection portions

A quantum device, comprising:

• a chip including:
• a substrate;
• and
• a wiring layer made of superconducting material on the substrate;
• a first wiring substrate including:
• a first substrate;
• a first wiring layer on a first surface of the first substrate;
• a second wiring layer on a second surface of the first substrate opposite the first surface of the first substrate;
• and
• a plurality of through vias penetrating the first substrate between on the first wiring layer and the second wiring layer;
• and
• a second wiring substrate including:
• a second substrate;
• and
• a third wiring layer formed on a first surface of the second substrate;
• a plurality of first connection portions bonded between the wiring layer of the chip and the first wiring layer on the first surface of the first substrate arranged opposed to the chip;
• and
• a plurality of second connection portions bonded between the second wiring layer on the second surface of the first substrate and the third wiring layer on the first surface of the second substrate arranged opposed to the second surface of the first substrate, wherein, in the first wiring substrate,
• the plurality of second connection portions on the second surface of the first substrate include
• one or more second connection portions arranged in a first row as viewed from an edge of the first substrate and corresponding respectively to one or more first connection portions on the first surface of the first substrate arranged in a first row as viewed from the edge of the first substrate, the one or more second connection portions respectively positioned closer to the edge than the one or more first connection portions on the first surface of the first substrate arranged in the first row, wherein, in the first wiring substrate,
• the plurality of second connection portions on the second surface of the first substrate include
• at least one second connection portion on the second surface arranged in the first row as viewed from the edge of the first substrate, and
• the plurality of first connection portions on the first surface of the first substrate include:
• at least one first connection portion corresponding to the at least one second connection portion on the first surface arranged in the first row as viewed from the edge of the first substrate,
• the at least one second connection portion located closer to the edge than the at least one first connection portion,
• a distance between a second position of the at least one second connection portion on the second surface, and a first position of the at least one first connection portion on the first surface, the second position being a closest position of the second connection portion to the edge, the first position being a closest position of the first connection portion to the edge,
• with the second position on the second surface and the first position on the first surface projected on a same plane
• is set to a predetermined ratio or more of a distance between a center of the at least one first connection portion and the first position.