Semiconductor device and manufacturing method of semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsNao Suganuma, Yosuke Sakurai, Seiji Noguchi, Ryutaro Hamasaki, Takuya Yamada
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AssigneeFuji Electric Co., Ltd.
InventorsNao Suganuma, Yosuke Sakurai, Seiji Noguchi, Ryutaro Hamasaki, Takuya Yamada
Estimating the term…
Provided is a semiconductor device including a transistor portion, in which the transistor portion has a drift region of a first conductivity type provided in a semiconductor substrate, a base region of a second conductivity type provided above the drift region, an accumulation region of the first conductivity type provided above the drift region, a plurality of trench portions provided to extend from a front surface of the semiconductor substrate to the drift region, and a trench bottom portion of the second conductivity type provided in bottom portions of the plurality of trench portions, and the accumulation region has a doping concentration with a half width of 0.3 μm or more.
A semiconductor device comprising a transistor portion, wherein
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