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US 12,628,273 B2Granted
Flexible circuit tape and flexible circuit board thereof
AssigneeChipbond Technology Corporation
InventorsChih-Hsiung Hu, Chun-Te Lee, Shyh-Jen Guo
Life of this patent
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Abstract
A flexible circuit tape includes flexible circuit boards each including a substrate unit and a circuit unit. The circuit unit is disposed on a routing region of the substrate unit and includes circuit lines each having an inner lead and an outer lead. A second width between the two outermost outer leads accounts for 60.00-99.00% of a first width of the substrate unit. The first width is greater than or equal to 80 mm such that number of outer leads can be increased.
Claims18
A flexible circuit tape comprising:
- a flexible carrier including a plurality of substrate units arranged in a first direction for transporting the flexible carrier, each of the plurality of substrate units includes a first side, a second side and a routing region which is located between the first and second sides in a second direction perpendicular to the first direction;
- and
- a circuit layer including a plurality of circuit units disposed on the routing region, a flexible circuit board includes one of the plurality of substrate units and one of the plurality of circuit units, each of the plurality of circuit units includes a plurality of first circuit lines each having a first inner lead and a first outer lead, the first inner lead is located on a chip mounting area within the routing region, the first outer lead is located outside the chip mounting area, wherein a first width between the first and second sides of each of the plurality of substrate units is greater than or equal to 80 mm in the second direction, and a second width from the first outer lead adjacent to the first side to the first outer lead adjacent to the second side accounts for 60.00-99.00% of the first width.
A flexible circuit board comprising:
- a substrate unit of a flexible carrier including a first side, a second side and a routing region which is located between the first and second sides in a second direction perpendicular to a first direction for transporting the flexible carrier;
- and
- a circuit unit disposed on the routing region and including a plurality of first circuit lines, each of the plurality of first circuit lines includes a first inner lead and a first outer lead, the first inner lead is located on a chip mounting area within the routing region, the first outer lead is located outside the chip mounting area, wherein a first width between the first and second sides of the substrate unit is greater than or equal to 80 mm in the second direction, and a second width from the first outer lead adjacent to the first side to the first outer lead adjacent to the second side accounts for 60.00-99.00% of the first width.
Dependencies are inferred from the claim text.