Electronic component
AssigneeTDK Corporation
InventorsYu Fukae, Tomoya Hanai, Yusuke Oba, Kenichi Yoshida, Katsuharu Yasuda, Takashi Ohtsuka
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AssigneeTDK Corporation
InventorsYu Fukae, Tomoya Hanai, Yusuke Oba, Kenichi Yoshida, Katsuharu Yasuda, Takashi Ohtsuka
Estimating the term…
To prevent interfacial peeling due to the stress of an insulating layer in a capacitor-inductor integrated electronic component having three or more conductor layers. An electronic component includes: a conductor layer M1 including a conductor pattern constituting an inductor; a conductor pattern overlapping a part of the conductor pattern through a dielectric film; an insulating layer covering the conductor layer M1 and conductor pattern; a conductor layer M2 provided on the insulating layer and including a conductor pattern constituting the inductor; and an insulating layer covering the conductor layer M2. The conductor layer M2 is formed to be branching from or independently of the conductor pattern and further includes a dummy pattern overlapping the conductor pattern. This prevents the stress of the insulating layer from being directly applied to the conductor pattern to thereby prevent peeling at the interface between the conductor layer M1 and the dielectric film.
An electronic component comprising:
An electronic component comprising:
An electronic component comprising:
Dependencies are inferred from the claim text.