Electronic device including insulating structure for speaker
AssigneeSamsung Electronics Co., Ltd.
InventorsIncheol Baek, Jungsik Park
Life of this patent
Estimating the term…
Abstract
An electronic device includes: a housing, a speaker, and an enclosure surrounding the speaker, the enclosure including a heat dissipation portion comprising a thermally conductive material facing the speaker and spaced apart from the speaker. The electronic device includes a support disposed between the speaker and the enclosure, the support including a first portion disposed on the speaker, a second portion facing the heat dissipation portion in the enclosure, and a third portion connecting the first portion and the second portion. An area of the first portion may be greater than an area of the second portion.
Claims20
An electronic device comprising:
- a speaker configured to output audio;
- an enclosure enclosing at least a portion of the speaker, the enclosure including a heat dissipation portion thermally connected to a rear plate of the electronic device, wherein the rear plate is thermally conductive;
- a supporting member contacted with a rear side of the speaker to support the speaker, wherein the supporting member is thermally conductive;
- and
- a heat insulating member disposed between the supporting member and the heat dissipation portion of the enclosure and contacted with both the supporting member and the heat dissipation portion of the enclosure,
- wherein an area of a first portion of the supporting member contacted with the rear side of the speaker is wider than an area of a second portion of the supporting member contacted with the heat insulating member such that a rate of heat flow through the heat insulating member is reduced and an amount of heat transferred to the heat dissipation portion of the enclosure via the heat insulating member is limited.
An electronic device comprising:
- a speaker configured to output audio;
- an enclosure surrounding at least a portion of the speaker and including a heat dissipation portion facing a rear side of the speaker, the heat dissipation portion being spaced apart from the rear side of the speaker and including metal;
- and
- a supporting member disposed between the rear side of the speaker and the heat dissipation portion of the enclosure, wherein the supporting member includes:
- a first portion disposed on the rear side of the speaker,
- a second portion facing the heat dissipation portion, and
- a third portion connecting the first portion and the second portion,
- wherein an area of the first portion of the supporting member disposed on the rear side of the speaker is wider than an area of the second portion of the supporting member facing the heat dissipation portion such that a rate of heat flow to the heat dissipation portion through the supporting member is reduced, and
- wherein the first, second, and third portions of the supporting member define at least a portion of an air gap configured for increasing a surface area of the supporting member contacted with air.
Dependencies are inferred from the claim text.