Dual resonator structure for temperature-compensated oscillators, including related apparatuses
AssigneeMicrochip Technology Incorporated
InventorSeungbae Lee
Life of this patent
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Abstract
An apparatus comprises a micromechanical system including a semiconductor body. The semiconductor body comprises a first resonator, a second resonator, and a supporting portion. The first resonator is to resonate at a first resonating frequency that is generally frequency-stable over a predetermined temperature range. The second resonator is to resonate at a second resonating frequency that is generally linearly decreasing or increasing as temperature increases over the predetermined temperature range. The supporting portion is to support both the first resonator and the second resonator.
Claims35
An apparatus comprising:
- a microelectromechanical system including a semiconductor body, the semiconductor body comprising:
- a first resonator, the first resonator including first resonating portions to resonate at a first resonating frequency that is generally frequency-stable over a predetermined temperature range;
- a second resonator, the second resonator including second resonating portions to resonate at a second resonating frequency that is generally linearly decreasing or increasing as temperature increases over the predetermined temperature range;
- and
- a supporting portion, the supporting portion to support both the first resonator and the second resonator, the supporting portion including a first connecting portion to the first resonator and a second connecting portion to the second resonator, the first connecting portion surrounding respective portions of respective perimeters of the first resonating portions of the first resonator, the second connecting portion surrounding respective portions of respective perimeters of the second resonating portions of the second resonator.
An apparatus comprising:
- an oscillator comprising:
- a microelectromechanical system including a semiconductor body, the semiconductor body comprising:
- a first resonator, the first resonator including first resonating portions to resonate at a first resonating frequency that is generally frequency-stable over a predetermined temperature range;
- at least one first drive electrode of the first resonator;
- at least one first sense electrode of the first resonator;
- a second resonator, the second resonator including second resonating portions to resonate at a second resonating frequency that is generally linearly decreasing or increasing as temperature increases over the predetermined temperature range;
- at least one second drive electrode of the second resonator;
- at least one second sense electrode of the second resonator;
- and
- a supporting portion to support both the first resonator and the second resonator, the supporting portion including a first connecting portion to the first resonator and a second connecting portion to the second resonator, the first connecting portion surrounding respective portions of respective perimeters of the first resonating portions of the first resonator, the second connecting portion surrounding respective portions of respective perimeters of the second resonating portions of the second resonator.
An apparatus comprising:
- a micromechanical system including a semiconductor body, the semiconductor body comprising:
- a first dual-ring resonator, the first dual-ring resonator to resonate at a first resonating frequency that is generally frequency-stable over a predetermined temperature range;
- a second dual-ring resonator, the second dual-ring resonator to resonate at a second resonating frequency that is generally linearly decreasing or increasing as temperature increases over the predetermined temperature range;
- and
- a supporting portion, the supporting portion to support both the first dual-ring resonator and the second dual-ring resonator, the supporting portion comprising a generally rectangular body having at least one bend to provide a differential orientation angle between the first dual-ring resonator and the second dual-ring resonator.
Dependencies are inferred from the claim text.