Light source device and method of manufacturing same
AssigneeNichia Corporation
InventorTadaaki Miyata
Life of this patent
Estimating the term…
Abstract
A light source device includes: a substrate having a support face; a lateral wall part disposed on the substrate and having an upper face and inner wall faces, the inner wall faces defining a space; a laser diode located in the space; a first submount having a mounting face bonded to an upper face of the laser diode, and an upper face located opposite the mounting face; a sealing member bonded to the upper face of the lateral wall part and the upper face of the first submount, thereby sealing the space; a heat dissipating block located above the first submount; and a heat conducting member located between the first submount and the heat dissipating block.
Claims17
A light source device comprising:
- a substrate having a support face;
- a lateral wall part disposed on the substrate and having an upper face and inner wall faces, the inner wall faces defining a space;
- a laser diode located in the space;
- a first submount having a mounting face bonded to an upper face of the laser diode, and an upper face located opposite the mounting face;
- a sealing member bonded to the upper face of the lateral wall part and the upper face of the first submount, thereby sealing the space;
- a heat dissipating block located above the first submount;
- and
- a heat conducting member located between the upper face of the first submount and a lowermost face of the heat dissipating block;
- wherein:
- a height of the upper face of the lateral wall part from the support face differs from a height of the upper face of the first submount from the support face;
- the heat conducting member is in thermal contact with the first submount and the heat dissipating block;
- and
- the heat dissipating block is bonded to the upper face of the lateral wall part via the sealing member.
A method of manufacturing a light source device comprising steps of:
- providing a light source unit comprising a submount, and a laser diode bonded to the submount;
- bonding the light source unit to a support face of a substrate such that the submount is above the laser diode;
- bonding a lateral wall part to the support face of the substrate such that the lateral wall part surrounds the light source unit;
- bonding a sealing member to the submount and the lateral wall part to seal the light source unit in a space defined by the substrate and the lateral wall part;
- disposing a heat conducting member above the submount of the light source unit, the heat conducting member having a first overall height and a first overall width;
- and
- deforming the heat conducting member to have a second overall height less than the first overall height and a second overall width greater than the first overall width, and bonding a heat dissipating block to the lateral wall part via the sealing member thereby bringing the heat dissipating block into thermal contact with the heat conducting member.
Dependencies are inferred from the claim text.