Semiconductor laser drive device, electronic equipment, and method for manufacturing semiconductor laser drive device
AssigneeSony Semiconductor Solutions Corporation
InventorsNobuaki Kaji, Tatsuya Oiwa, Hirohisa Yasukawa
Life of this patent
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Abstract
In a semiconductor laser drive device, wiring inductance between a semiconductor laser and a laser driver is reduced. A substrate has a laser driver built inside. A semiconductor laser is mounted on one surface of a substrate of the semiconductor laser drive device and emits irradiation light from an irradiation surface. A connection wiring electrically connects the laser driver and the semiconductor laser with a wiring inductance of 0.5 nH or less. A passive component is disposed to face a side of the semiconductor laser having the least number of pads and connects to the semiconductor laser and the laser driver.
Claims20
A semiconductor laser drive device, comprising:
- a substrate with a laser driver built inside;
- a semiconductor laser mounted on one surface of the substrate;
- connection wiring that electrically connects the laser driver and the semiconductor laser,
- wherein the connection wiring has a wiring inductance of 0.5 nH or less;
- and
- a passive component that is disposed to face a side of the semiconductor laser having a least number of pads and connects to the semiconductor laser and the laser driver,
- wherein the passive component is provided on a same plane as the semiconductor laser in a cross-sectional view, and
- wherein at least a part of the passive component is disposed to overlap above the laser driver.
A method for manufacturing a semiconductor laser drive device, comprising:
- forming a laser driver on an upper surface of a support plate;
- forming connection wiring of the laser driver and forming a substrate with the laser driver built inside;
- mounting a semiconductor laser on one surface of the substrate and forming connection wiring that electrically connects, via the connection wiring, the laser driver and the semiconductor laser,
- wherein the connection wiring has with a wiring inductance of 0.5 nH or less;
- and
- disposing a passive component connecting the semiconductor laser and the laser driver to face a side of the semiconductor laser having a least number of pads,
- wherein the passive component is provided on a same plane as the semiconductor laser in a cross-sectional view, and
- wherein at least a part of the passive component is disposed to overlap above the laser driver.
Electronic equipment, comprising:
- an optical system;
- semiconductor laser drive device that receives light from the optical system, the semiconductor laser device including:
- a substrate with a laser driver built inside;
- a semiconductor laser mounted on one surface of the substrate;
- connection wiring that electrically connects the laser driver and the semiconductor laser,
- wherein the connection wiring has with a wiring inductance of 0.5 nH or less;
- and
- a passive component that is disposed to face a side of the semiconductor laser having a least number of pads and connects to the semiconductor laser and the laser driver,
- wherein the passive component is provided on a same plane as the semiconductor laser in a cross-sectional view;
- and
- a controller that processes signals from the semiconductor laser drive device.
Dependencies are inferred from the claim text.