Capacitor assembly package structure and method of manufacturing the same, and electronic device

A method of manufacturing a capacitor assembly package structure, comprising:

• providing a capacitor assembly, wherein the capacitor assembly includes a plurality of capacitor structures that are stacked in sequence and electrically connected to each other, each of the capacitor structures has a positive electrode portion and a negative electrode portion, the capacitor assembly has a plurality of stacking gaps, and each of the stacking gaps is correspondingly formed between two adjacent ones of the capacitor structures;
• forming a plurality of first insulating package bodies that are configured to be respectively received in the stacking gaps of the capacitor assembly;
• and
• forming a second insulating package body that is configured to cover the first insulating package bodies and the capacitor structures;
• wherein a solid content of each of the first insulating package bodies is less than a solid content of the second insulating package body;
• wherein a total volume of the first insulating package bodies is smaller than a volume of the second insulating package body;
• wherein each of the first insulating package bodies and the second insulating package body have the same or different insulating materials.

An electronic device configured to use a capacitor assembly package structure, the capacitor assembly package structure comprising:

• a capacitor assembly including a plurality of capacitor structures that are stacked in sequence and electrically connected to each other, wherein each of the capacitor structures has a positive electrode portion and a negative electrode portion, the capacitor assembly has a plurality of stacking gaps, and each of the stacking gaps is correspondingly formed between two adjacent ones of the capacitor structures;
• a plurality of first insulating package bodies configured to be respectively received in the stacking gaps of the capacitor assembly;
• a second insulating package body configured to cover the first insulating package bodies and the capacitor structures;
• and
• an electrode assembly including a first electrode structure and a second electrode structure, wherein the first electrode structure and the second insulating package body cooperate with each other and are electrically connected to the positive electrode portion of the capacitor structure, and the second electrode structure and the second insulating package body cooperate with each other and are electrically connected to the negative electrode portion of the capacitor structure;
• wherein a solid content of each of the first insulating package bodies is less than a solid content of the second insulating package body;
• wherein a total volume of the first insulating package bodies is smaller than a volume of the second insulating package body;
• wherein each of the first insulating package bodies and the second insulating package body have the same or different insulating materials.