Semiconductor device

A semiconductor device comprising:

• a first semiconductor die including a first interface circuit;
• and
• a second semiconductor die stacked with the first semiconductor die and including a second interface circuit, the second interface circuit being connected to the first semiconductor die by a plurality of via structures,
• wherein the first interface circuit is configured to generate an error detection code for transmission data and transmit a data signal including the transmission data and the error detection code to the second interface circuit through at least some of the plurality of via structures, and
• wherein the second interface circuit is configured to generate response data, indicating whether the data signal is normally received, and an error correction code of the response data, and transmit a response signal including the response data and the error correction code to the first interface circuit through at least one via structure among the plurality of via structures.

A semiconductor device comprising:

• a first semiconductor die including a first interface circuit;
• and
• a second semiconductor die including a second interface circuit connected to the first interface circuit by a plurality of via structures, the second semiconductor die being stacked with the first semiconductor die,
• wherein the first interface circuit includes a plurality of data transmission circuits connected to data via structures among the plurality of via structures and a first-in-first-out (FIFO) circuit commonly connected to the plurality of data transmission circuits, and
• wherein each of the plurality of data transmission circuits includes a latch and at least one flipflop, each being configured to receive transmission data output from the FIFO circuit, and a multiplexer connected between the latch and the at least one flipflop and a corresponding data via structure among the data via structures.