Semiconductor structure body and method for manufacturing semiconductor structure body with alignment between stories of the same
AssigneeKioxia Corporation
InventorManabu Takakuwa
Life of this patent
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Abstract
A semiconductor structure body of an embodiment includes a stacked body. In the stacked body, a plurality of conductive layers and a plurality of insulating layers are alternately stacked, and a plurality of through holes penetrating the conductive layers and the insulating layers in the stacking direction are provided. In the interior of the stacked body, in a region corresponding to an identical pair of coordinates in a planar coordinate system intersecting the stacking direction, a plurality of identical alignment marks or deviation measurement marks are formed, with one or more stories each including a predetermined number of conductive layers and a predetermined number of insulating layers interposed therebetween.
Claims8
A semiconductor structure body
- comprising a stacked body with multiple stories in each of which a plurality of conductive layers and a plurality of insulating layers are alternately stacked, the stacked body including a plurality of through holes penetrating the conductive layers and the insulating layers in a stacking direction, wherein,
- the multiple stories of the stacked body is four stories or more,
- the stacked body includes, in a region corresponding to an identical pair of coordinates in a planar coordinate system intersecting the stacking direction, a plurality of identical alignment marks or deviation measurement marks, and
- the identical alignment marks or the deviation measurement marks are placed in a region corresponding to a first pair of coordinates on an uppermost surface of an N-th story (N is an integer equal to or larger than 2) of the multiple stories and a region corresponding to the first pair of coordinates on an uppermost surface of an (N+2)-th story of the multiple stories.
A semiconductor structure body
- comprising a stacked body with multiple stories in each of which a plurality of conductive layers and a plurality of insulating layers are alternately stacked, the stacked body including a plurality of through holes penetrating the conductive layers and the insulating layers in a stacking direction, wherein,
- the multiple stories of the stacked body is five stories or more,
- the stacked body includes, in a region corresponding to an identical pair of coordinates in a planar coordinate system intersecting the stacking direction, a plurality of identical alignment marks or deviation measurement marks, and
- the identical alignment marks or the deviation measurement marks are placed in a region corresponding to a first pair of coordinates on an uppermost surface of an N-th story (N is an integer equal to or larger than 2) of the multiple stories and a region corresponding to the first pair of coordinates on an uppermost surface of an (N+3)-th story of the multiple stories.
Dependencies are inferred from the claim text.