Structured film and method of using same to form a pattern on a substrate

A structured film for forming a pattern on a substrate, the structured film comprising:

• a polymeric support layer;
• an adhesive layer;
• an etch resist layer disposed between the polymeric support layer and the adhesive layer;
• a structured resin layer disposed between the polymeric support layer and the etch resist layer, the structured resin layer comprising a structured major surface comprising a plurality of engineered structures, the etch resist layer at least partially filling spaces between adjacent engineered structures to substantially planarize the structured major surface;
• and
• a dynamic separating layer disposed between the structured resin layer and the polymeric support layer;
• and
• one or more unstructured layers having a total thickness of less than 10 microns and disposed between the etch resist layer and the adhesive layer.