400G silicon photonic integrated optical module with embedded thermoelectric cooler (TEC) substrate

A 400G silicon photonic integrated optical module with an embedded thermoelectric cooler (TEC) substrate, comprising:

• a housing, wherein an accommodating cavity is formed in the housing;
• a printed circuit board (PCB) substrate, wherein the PCB substrate is provided in the accommodating cavity, and a TEC substrate is embedded into the PCB substrate;
• and
• a silicon photonic integrated circuit board, wherein the silicon photonic integrated circuit board is provided on the TEC substrate, the silicon photonic integrated circuit board is provided with an extended segment, and the extended segment extends along a side of the PCB substrate in a length direction of the PCB substrate to the PCB substrate,
• wherein a fiber array, an electronic integrated circuit board, a light emission assembly, and a light-receiving detector are arranged on the silicon photonic integrated circuit board;
• the light emission assembly is mounted on the silicon photonic integrated circuit board in an upside-down manner;
• and the light emission assembly and the light-receiving detector are provided above the TEC substrate.