A method for a quality inspection of an etching paste material based on a spectral response difference, comprising:
- obtaining, using a multi-band spectral acquisition system, multi-band spectral signals and a material thickness from a surface of the etching paste material, wherein the multi-band spectral acquisition system comprises an area array camera, a multi-band light source system, a thickness measurement module, and a trigger controller synchronizing illumination and image capture;
- performing a spectral tomography decomposition based on the multi-band spectral signals to obtain a layered spectral map of an internal of the etching paste material;
- generating material density gradient distribution values by calculating an absorption intensity for each virtual layer based on spectral response characteristics in the layered spectral map, determining a layer thickness distribution based on the material thickness and layered interface position information, calculating a layer density based on the absorption intensity and the layer thickness distribution, and computing spatial gradients of the layer density;
- identifying a position of density mutation boundary based on the material density gradient distribution values;
- applying an excitation beam at the position of density mutation boundary to induce a resonance phenomenon and obtain a resonance response parameter of the etching paste material, including selecting an excitation beam frequency based on an inherent resonance frequency at the position of density mutation boundary and a frequency scanning and fine-tuning operation to obtain an optimal excitation frequency, and obtaining the resonance response parameter by monitoring at least amplitude and phase changes of the resonance phenomenon;
- generating stress field reconstruction data of the internal of the etching paste material based on the resonance response parameter;
- determining coordinate of stress concentration point based on the stress field reconstruction data, performing a reverse optical tracking from the stress concentration point outward to obtain a defect formation path, generating degradation prediction data from the defect formation path;
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- establishing a self-organizing optical monitoring grid in potential defect regions based on the degradation prediction data;
- performing an adaptive density adjustment on the self-organizing optical monitoring grid to obtain an optimized grid distribution, applying a differentiated spectral excitation to the optimized grid distribution to form a hierarchical spectral fingerprint library, generating a material state boundary recognition standard based on the hierarchical spectral fingerprint library;
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- detecting a phase transition critical point of the etching paste material based on the material state boundary recognition standard to obtain a phase transition boundary;
- applying a pulsed beam at multiple synchronous excitation points set within a boundary region surrounding the phase transition boundary to induce surface deformation of the etching paste material and obtain surface deformation response characteristics, generating material stability boundary parameters based on the surface deformation response characteristics;
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- constructing a multi-point linked defect blocking network based on the material stability boundary parameters, performing a defect analysis on the multi-point linked defect blocking network by determining an energy requirement of each of blocking points, establishing energy transmission channels between each of the blocking points based on the energy requirements, achieving energy balance between the blocking points through the energy transmission channels to obtain a distributed energy field, and performing a network integration processing on the distributed energy field to form an interconnected optical energy field, monitoring a cooperative response of the interconnected optical energy field to obtain network stability data;
- determining a material quality grade based on the network stability data;
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- identifying abnormal position coordinates based on the material quality grade and the network stability data, obtaining the abnormal position coordinates, performing a phase adjustment on the hierarchical spectral fingerprint library to obtain a phase difference spectral set, conducting a phase comparison marking on the abnormal position coordinates using the phase difference spectral set to complete the quality inspection of the etching paste material based on the spectral response difference.