Capacitive MEMS sensing diagnostic mode

A pressure sensor comprising:

• a microelectromechanical system (MEMS) device comprising a first pressure sensitive capacitor element, a second pressure sensitive capacitor element, a first reference capacitive element, and a second reference capacitive element arranged in a bridge configuration, a first output pad, and a second output pad;
• and
• an application-specific integrated circuit (ASIC) in electrical communication with the MEMS device comprising a first input pad and a second input pad, a measurement interface comprising a first input and a second input, a first switch coupled between the first input pad of the ASIC and the second input pad of the ASIC, a second switch coupled between the second input of the measurement interface and the second input pad of the ASIC, and a third switch coupled between the first input of the measurement interface and the first input pad of the ASIC,
• wherein the first output pad of the MEMS device is directly connected to the first input pad of the ASIC, and wherein the second output pad of the MEMS device is directly connected to the second input pad of the ASIC.

A pressure sensor comprising:

• a microelectromechanical system (MEMS) device comprising a first pressure sensitive capacitor element, a second pressure sensitive capacitor element, a first reference capacitive element, and a second reference capacitive element arranged in a bridge configuration, a first output pad, and a second output pad;
• and
• an application-specific integrated circuit (ASIC) in electrical communication with the MEMS device comprising a first input pad and a second input pad, a measurement interface comprising a first input and a second input, a first switch coupled between the second input pad of the ASIC and a source of bias voltage, a second switch coupled between the second input pad of the ASIC and the second input of the measurement interface, a third switch coupled between the first input pad of the ASIC and the source of bias voltage, and a fourth switch coupled between the first input pad of the ASIC and the first input of the measurement interface,
• wherein the first output pad of the MEMS device is directly connected to the first input pad of the ASIC, and wherein the second output pad of the MEMS device is directly connected to the second input pad of the ASIC.