Semiconductor pressure sensor and manufacturing method therefor
AssigneeMitsubishi Electric Corporation
InventorKimitoshi Sato
Life of this patent
Estimating the term…
Abstract
A semiconductor pressure sensor according to the present disclosure includes: a first silicon substrate; a first silicon oxide film provided on the first silicon substrate and forming a closed space together with the first silicon substrate; a second silicon substrate provided on the first silicon oxide film; a gauge resistor provided on a surface layer of a surface of the second silicon substrate opposite to a surface on which the first silicon oxide film is provided at a position overlapping with the closed space in a plan view; a first electrode electrically connected to one end of the gauge resistor; and a second electrode electrically connected to another end of the gauge resistor.
Claims7
A semiconductor pressure sensor comprising:
- a first silicon substrate;
- a first silicon oxide film provided on the first silicon substrate and forming a closed space together with the first silicon substrate;
- a second silicon substrate provided on the first silicon oxide film;
- a gauge resistor provided on a surface layer of a surface of the second silicon substrate opposite to a surface on which the first silicon oxide film is provided at a position overlapping with the closed space in a plan view;
- a first electrode electrically connected to one end of the gauge resistor;
- and
- a second electrode electrically connected to another end of the gauge resistor,
- wherein the first silicon oxide film includes:
- a thick film portion having one surface in contact with the first silicon substrate and another surface in contact with the second silicon substrate;
- and
- a first thin film portion having one surface facing the first silicon substrate across the closed space and another surface in contact with the second silicon substrate,
- such that the thick film portion and the first thin film portion are parts of the first silicon oxide film.
Dependencies are inferred from the claim text.