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US 12,624,480 B2Granted
Shoe upper including three-dimensional pattern
AssigneeSoo Bok Song
InventorsSoo Bok Song, Won Seok Song, Kapsoo Hwang, Sinje Park
Life of this patent
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Abstract
The present disclosure provides a shoe upper woven using a warp yarn and a weft yarn, having the weft yarn formed so that a first weft yarn which is a high-stretch yarn and the second weft which is a regular yarn overlap each other, and including a three-dimensional pattern region in which the first weft yarn is disposed on a rear surface and the second weft yarn is disposed on a surface to form the three-dimensional pattern on the surface.
Claims9
A shoe upper including a three-dimensional pattern, wherein the shoe upper is woven using a warp yarn and a weft yarn,
- a first weft yarn which is a high-stretch yarn and the second weft which is a yarn overlap each other to form the weft yarn,
- wherein the shoe upper comprises a three-dimensional pattern region in which the first weft yarn is disposed on a rear surface and the second weft yarn is disposed on an upper to form the three-dimensional pattern on the surface, and
- wherein the shoe upper further comprises a flat pattern region in which the first weft yarn is disposed on the upper surface, the second weft yarn is disposed on the rear surface, and the three-dimensional pattern is not formed on the upper surface.
Dependencies are inferred from the claim text.