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US 12,624,441 B2Granted
Vacuum deposition facility and method for coating a substrate
AssigneeArcelorMittal
InventorsEric Silberberg, Thiago Rabelo Nunes Campos, Negar Gilani
Life of this patent
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Abstract
A vacuum deposition facility for continuously depositing, on a running substrate, coatings formed from at least one metal inside a Vacuum deposition facility including a vacuum chamber, a coated substrate coated with at least one metal on both sides of the substrate and a coated metallic substrate.
Claims14
A vacuum deposition facility for continuously depositing, on a running substrate, coatings formed the at least one metal, the facility comprising:
- a vacuum chamber, the substrate capable of running along a given path through the vacuum chamber, wherein the vacuum chamber further comprises:
- at least two vapor ejectors facing each other and positioned respectively with the angles α and α′ between the respective vapor ejector and the axis perpendicular to the running direction of the substrate, the axis being in the plane of the substrate, α and α′ both satisfying the following equation:
- α
- =
- arc
-
- cos
-
- (
- Ws
- -
- (
- D
-
- 1
- +
- D
-
- 2
- )
- We
- )
-
- with
-
- 0
-
- °
- <
- α
- <
- 82
-
- °
- ,
- α
- ′
- =
- arc
-
- cos
-
- (
- Ws
- -
- (
- D
-
- 1
- +
- D
-
- 2
- )
- We
- )
-
- with
-
- 0
-
- °
- <
- α
- ′
- <
- 82
-
- °
- ,
- D1 and D2 being the distance between the ejectors and each substrate edge along the axis, Ws being the substrate width, the vapor ejectors having an elongated shape and including a slot defined by the slot width We, the vapor ejectors having a same rotation axis.
68 more elements
Dependencies are inferred from the claim text.