Thermal conductive silicone composition

A thermal conductive silicone composition comprising the following components (A) to (C):

• (A) 100 parts by mass of an organopolysiloxane having a kinematic viscosity at 25° C. of 10 to 500,000 mm2/s, wherein the organopolysiloxane comprises an organopolysiloxane having a hydrolysable group represented by the following general formula (2) and a linear organopolysiloxane represented by the following formula (3):
• wherein R2 represents an alkyl group having a carbon number of 1 to 6, R3 each independently represents an unsubstituted or substituted monovalent hydrocarbon group having a carbon number of 1 to 18 without containing an alkenyl group, and b is 5 to 120,
• wherein R1 does not comprise an alkenyl group, and each independently represents an unsubstituted or substituted monovalent hydrocarbon group having a carbon number of 1 to 18, and m is a number with which the organopolysiloxane has a kinematic viscosity at 25° C. of 10 to 500,000 mm2/s,
• wherein the component (A) comprises the hydrolysable group-containing organopolysiloxane represented by the general formula (2) in an amount of 30 to 90% by mass relative to the total mass of the component (A);
• (B) 10 to 2,000 parts by mass of a thermal conductive filler having an average particle size of 0.01 to 100 μm;
• and
• (C) 1,000 to 10,000 parts by mass of gallium or a gallium alloy having a melting point of −20 to 100° C.