Dimensionally stable, wipe-on, modified-polyether-polyurethane-based adhesive compound

Abstract

The present invention relates to a dimensionally stable adhesive compound which is formulated so as to be largely water- and solvent-free and can be brought into contact with the substrate to be bonded by being wiped on in the form of a thin adhesive film that is suitable in particular for bonding materials obtained from plant fibers. The organic constituent of the adhesive compound according to the invention consists predominantly of a mixture of polyether polyurethanes which are end-capped with at least two monohydric aliphatic alcohols of different chain lengths. The invention also relates to a method for applying a tacky film to a planar substrate, preferably to paper, by wiping the adhesive compound onto the point of contact with the substrate.

Dependencies are inferred from the claim text.