Aqueous dispersion comprising inorganic particles

Abstract

Inorganic particles comprised in an aqueous dispersion according to the present invention consist of agglomerates of crystalline and amorphous microparticles, and exhibit spherical and smooth surfaces. The spherical appearance, low crystallinity, and narrow particle size distribution of the inorganic particles are further advantageous in reducing scratch defects in a CMP process. In addition, since the microparticles on the inorganic particle surfaces provide more active sites and thus the removal rate is high, the inorganic particles may be advantageous as next-generation CMP polishing materials. In addition, the aqueous dispersion according to the present invention further comprises an amino acid, and the amino acid may be adsorbed on a surface of a silicon oxide wafer to strengthen electrostatic attraction between the silicon oxide wafer and the inorganic particles, resulting in an effect of further improving the removal rate.

Dependencies are inferred from the claim text.