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US 12,624,176 B2Granted
Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsHirosuke Saito, Yiqun Wang, Hiroharu Inoue
Life of this patent
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Abstract
An aspect of the present invention is a resin composition containing a first styrene-based block copolymer having a hardness of 20 to 70, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, and a curing agent. In Formula (1), p represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group. In Formula (2), R4 represents a hydrogen atom or an alkyl group.
Claims17
A resin composition comprising:
- a first styrene-based block copolymer having a durometer hardness measured using a type A durometer of 20 to 42;
- a second styrene-based block copolymer having a durometer hardness measured using a type A durometer of 78 or more;
- a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule:
- wherein in Formula (1), p represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group,
- wherein in Formula (2), R4 represents a hydrogen atom or an alkyl group;
- and
- a curing agent containing an allyl compound.
4 more elements
Dependencies are inferred from the claim text.