Thermal print head

A thermal print head, comprising:

• a substrate;
• a glaze layer, disposed on the substrate;
• and
• a wiring layer, disposed on the glaze layer, wherein
• the wiring layer includes a plurality of bonding pads,
• the plurality of bonding pads are divided into a plurality of groups,
• each of the plurality of groups includes a first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad,
• a first group of the plurality of groups is adjacent to a second group of the plurality of groups along a first direction,
• the second bonding pad of the first group is located between a center of the first bonding pad of the first group and a center of the third bonding pad of the first group along the first direction,
• the fourth bonding pad of the first group is located between the center of the third bonding pad of the first group and a center of the first bonding pad of the second group along the first direction,
• the third bonding pad of one of the plurality of groups is disposed between the first bonding pad, the second bonding pad, and the fourth bonding pad of the one of the plurality of groups along a second direction perpendicular to the first direction, and
• the first bonding pads of the plurality of groups are arranged to form a first row along the first direction,
• the third bonding pads of the plurality of groups are arranged to form a second row along the first direction, and
• the second bonding pads and the fourth bonding pads of the plurality of groups are arranged to form a third row along the first direction,
• wherein further the first row, the second row, and the third row are arranged on positions shifted from one another in the second direction.