Method for machining a metal-ceramic substrate, system for such a method and metal-ceramic substrates produced using such a method
AssigneeRogers Germany GmbH
InventorsThomas Kohl, Bernhard Rettinger
Life of this patent
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Abstract
A method of processing a metal-ceramic substrate (1), including providing a metal-ceramic substrate (1), wherein the metal-ceramic substrate (1) comprises at least one metal layer (21) and one ceramic element (11), which extend along a main extension plane (HSE) and are arranged one above the other along a stacking direction (S) extending perpendicularly to the main extension plane (HSE), and forming a recess (15), in particular a through recess (15), in the metal-ceramic substrate (1) by processing by means of laser light (10), in particular of an ultrashort pulse (UKP) laser.
Claims14
A method of processing and fastening a metal-ceramic substrate (1), comprising
- providing a metal-ceramic substrate (1), wherein the metal-ceramic substrate (1) comprises at least one metal layer (21) and one ceramic element (11), which extend along a main extension plane (HSE) and are arranged one above the other along a stacking direction(S) extending perpendicularly to the main extension plane (HSE), and
- forming a recess (15), in the metal-ceramic substrate (1) by processing by means of laser light (10), characterized in that the recess (15) is used as an area through which a fastening element engages in order to fasten the metal-ceramic substrate (1) to a housing or another component and wherein as laser light ultrashort laser pulses are used to avoid the formation of burrs, wherein the laser light is directed onto the metal-ceramic substrate via at least one pivotable mirror element or reflective element and is moved over the metal-ceramic substrate by means of the at least one pivotable mirror element or reflective element, wherein the laser light is guided in section along a curved contour to form the recess.
Dependencies are inferred from the claim text.