Methods, systems, and articles for producing a film pattern on a substrate material

Abstract

Aspects herein are directed to systems, methods, and articles for producing a patterned film and using the patterned film to form a pattern of discrete overlay film structures on a substrate material. A uniform thickness of a film material is deposited on to a first surface of a run of carrier sheets, where each carrier sheet includes one or more holes extending there through. A first carrier sheet is extracted from the run of carrier sheets, and a second surface of the carrier sheet is positioned on a substrate material. Heat and/or pressure is applied to the film material to cause the film material to transfer to the substrate material through the one or more holes in the carrier sheet forming a pattern of discrete overlay film structures on the substrate material. The carrier sheet along with remaining portions of the film material is removed from the substrate material.

Dependencies are inferred from the claim text.