Heat dissipation structure for LED light

A heat dissipation device applicable for eliminating a heat energy generated by at least one LED light bead, comprising:

• a circuit board equipped with at least one first metal layer and at least one second metal layer respectively located on two opposite sides, the circuit board having at least one heat conductive hole,
• wherein the first metal layer of the circuit board is connected to a heat dissipation base of the LED light bead through a first heat conductive material layer, so that the heat energy generated by the LED light bead is transferred from the heat dissipation base to the second metal layer of the circuit board through the first heat conductive material layer, the first metal layer and the heat conductive hole;
• and
• a heat sink, wherein the second metal layer of the circuit board is connected to the heat sink through a second heat conductive material layer, so that the heat energy generated by the LED light bead is conducted from the second metal layer to the heat sink through the second heat conductive material layer, wherein materials of the first heat conductive material layer and/or the second heat conductive material layer is/are respectively selected from a group consisting of solder tin and silver glue.