Light-emitting photosensitive sensor structure and manufacturing method thereof

A method for manufacturing a light-emitting photosensitive sensor structure, the method comprising:

• preparing a package substrate, wherein the package substrate is formed with a cavity enclosed by a light-shield frame, and a first line layer is formed on the bottom of the cavity;
• forming a light transmission channel on the light-shield frame, wherein the light transmission channel extends beyond a cutting line of the light-shield frame;
• installing a light-emitting photosensitive sensor in the cavity of the package substrate so that the light-emitting photosensitive sensor is electrically connected to the first line layer;
• filling the cavity and the light transmission channel with a transparent packaging material to form a transparent packaging layer on the light-emitting photosensitive sensor;
• forming a light-shield layer on the transparent packaging layer;
• and
• obtaining a light-emitting photosensitive sensor structure having a directional light transmission channel by cutting along a cutting line of the light-shield frame.