Semiconductor devices
AssigneeSamsung Electronics Co., Ltd.
InventorsHongsik Shin, Sungwoo Kang, Dongkwon Kim, Hyonwook Ra, Jeongyeon Seo, Kyungyub Jeon
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AssigneeSamsung Electronics Co., Ltd.
InventorsHongsik Shin, Sungwoo Kang, Dongkwon Kim, Hyonwook Ra, Jeongyeon Seo, Kyungyub Jeon
Estimating the term…
A semiconductor device includes first and second gate structures, first and second contact plug structures and a first wiring on a substrate. The first and second source/drain layers are formed on portions of the substrate adjacent to the first and second gate structures, respectively. The first and second contact plug structures are formed on the first and second source/drain layers, respectively. The first wiring contacts an upper surface of the first gate structure. The first gate structure includes a first gate electrode and a first gate insulation pattern on a lower surface and a sidewall of the first gate electrode. The second gate structure includes a second gate electrode and a second gate insulation pattern on a lower surface and a sidewall of the second gate electrode. The upper surface of the second gate electrode is lower than an upper surface of the first gate electrode.
A semiconductor device, comprising:
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.