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US 12,620,963 B2Granted
Vibration device
AssigneeSeiko Epson Corporation
InventorAkihiro Murata
Life of this patent
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Abstract
A vibration device includes a vibration element; a package including a base that is a semiconductor substrate having a first surface and a second surface that are in front-back relation, with the vibration element disposed at the first surface, an oscillation circuit that is disposed at the base and electrically coupled to the vibration element, and a lid that is a semiconductor substrate bonded to the base so as to accommodate the vibration element and electrically coupled to the base, and a resin layer disposed at the outer surface of the package.
Claims9
A vibration device comprising:
- a vibration element;
- a package including a base that is a semiconductor substrate having a first surface and a second surface that are in front-back relation, with the vibration element disposed at the first surface, an oscillation circuit that is disposed at the base and electrically coupled to the vibration element, and a lid that is a semiconductor substrate bonded to the base so as to accommodate the vibration element and electrically coupled to the base;
- and
- a resin layer disposed at an outer surface of the package,
- wherein the base and the lid are directly bonded to each other via a metal layer,
- in a plan view, an outer edge of the metal layer is located inside an outer edge of the base and an outer edge of the lid, and the resin layer is disposed in a gap formed between the base and the lid by the metal layer, and
- the resin layer is disposed at the outer edge of a side surface connecting the first surface and the second surface of the package has a flat surface at a portion corresponding to the gap.
4 more elements
Dependencies are inferred from the claim text.