Perovskite-based white or multi-wavelength laser

A method for manufacturing an optoelectronic device using halide perovskite layers, the method comprising:

• providing a substrate;
• depositing a first spacer layer on the substrate;
• depositing a first emission layer on the first spacer layer;
• depositing a second spacer layer on the first emission layer;
• depositing a second emission layer on the second spacer layer;
• depositing a third spacer layer on the second emission layer;
• depositing a third emission layer on the third spacer layer;
• depositing a fourth spacer layer on the third emission layer;
• wherein the first emission layer, the second emission layer, and the third emission layer each comprise a halide perovskite layer;
• wherein the halide perovskite layer of each of the first emission layer, the second emission layer, and the third emission layer comprises a three-dimensional halide perovskite, a two-dimensional halide perovskite, or a combination thereof;
• wherein the steps of depositing the first spacer layer, the first emission layer, the second spacer layer, the second emission layer, the third spacer layer, the third emission layer, and the fourth spacer layer are each independently conducted via a process of thermal evaporation using a thermal evaporation vacuum chamber system;
• wherein the substrate is loaded onto a substrate holder of the thermal evaporation vacuum chamber system;
• wherein each of the first spacer layer, the second spacer layer, the third spacer layer, and the fourth spacer layer comprise a transparent polymer or a transparent metal having a refractive index that is less than, greater than, or equal to a refractive index of each of the first emission layer, the second emission layer, and the third emission layer, respectively;
• and
• wherein the halide perovskite layer of each of the first emission layer, the second emission layer, and the third emission layer comprises CsPbI1.5Br1.5, CsPbBr3, and CsPbCl3, respectively;
• further comprising the steps of:
• (a) sequentially and separately loading each of the CsPbI1.5Br1.5 of the first emission layer, the transparent polymer or the transparent metal of the second spacer layer, the CsPbBr3 of the second emission layer, the transparent polymer or the transparent metal of the third spacer layer, the CsPbCl3 of the third emission layer, and the transparent polymer or the transparent metal of the fourth spacer layer into a tungsten boat of the thermal evaporation vacuum chamber system prior to the steps of depositing the respective layers;
• and
• (b) for each of the loaded CsPbI1.5Br1.5 of the first emission layer, the transparent polymer or the transparent metal of the second spacer layer, the CsPbBr3 of the second emission layer, the transparent polymer or the transparent metal of the third spacer layer, the CsPbCl3 of the third emission layer, and the transparent polymer or the transparent metal of the fourth spacer layer, reducing a pressure within the thermal evaporation vacuum chamber system to about 10−4 mbar or less and increasing a current of the tungsten boat to about 17 amps or more to allow the respective layers within the tungsten boat to sequentially and separately evaporate toward the substrate thereby depositing:
• the evaporated CsPbI1.5Br1.5 of the first emission layer on the substrate to obtain a CsPbI1.5Br1.5 first emission layer film on the substrate,
• the evaporated transparent polymer or the evaporated transparent metal of the second spacer layer on the CsPbI1.5Br1.5 first emission layer film to obtain a transparent polymer or a transparent metal second spacer layer film on the CsPbI1.5Br1.5 first emission layer film,
• the evaporated CsPbBr3 of the second emission layer on the transparent polymer or the transparent metal second spacer layer film to obtain a CsPbBr3 second emission layer film on the transparent polymer or the transparent metal second spacer layer film,
• the evaporated transparent polymer or the evaporated transparent metal of the third spacer layer on the CsPbBr3 second emission layer film to obtain a transparent polymer or a transparent metal third spacer layer film on the CsPbBr3 second emission layer film,
• the evaporated CsPbCl3 of the third emission layer on the transparent polymer or the transparent metal third spacer layer film to obtain a CsPbCl3 third emission layer film on the transparent polymer or the transparent metal third spacer layer film, and
• the evaporated transparent polymer or the evaporated transparent metal of the fourth spacer layer on the CsPbCl3 third emission layer film to obtain a transparent polymer or a transparent metal fourth spacer layer film on the CsPbCl3 third emission layer film.

A method for manufacturing an optoelectronic device using halide perovskite layers, the method comprising:

• providing a substrate;
• depositing a first spacer layer on the substrate;
• depositing a first emission layer on the first spacer layer;
• depositing a second spacer layer on the first emission layer;
• depositing a second emission layer on the second spacer layer;
• depositing a third spacer layer on the second emission layer;
• depositing a third emission layer on the third spacer layer;
• depositing a fourth spacer layer on the third emission layer;
• wherein the first emission layer, the second emission layer, and the third emission layer each comprise a halide perovskite layer;
• wherein the halide perovskite layer of each of the first emission layer, the second emission layer, and the third emission layer comprises a three-dimensional halide perovskite, a two-dimensional halide perovskite, or a combination thereof;
• wherein the steps of depositing the first spacer layer, the first emission layer, the second spacer layer, the second emission layer, the third spacer layer, the third emission layer, and the fourth spacer layer are each independently conducted via a process of thermal evaporation using a thermal evaporation vacuum chamber system;
• wherein the substrate is loaded onto a substrate holder of the thermal evaporation vacuum chamber system;
• wherein each of the first spacer layer, the second spacer layer, the third spacer layer, and the fourth spacer layer comprise a transparent polymer or a transparent metal having a refractive index that is greater than or equal to a refractive index of each of the first emission layer and the second emission layer, respectively;
• and
• wherein the halide perovskite layer of each of the first emission layer, the second emission layer, and the third emission layer comprises CsPbI1.5Br1.5, CsPbBr3, and CsPbCl3, respectively;
• (a) sequentially and separately loading each of the CsPbI1.5Br1.5 of the first emission layer, the transparent polymer or the transparent metal of the second spacer layer, the CsPbBr3 of the second emission layer, the transparent polymer or the transparent metal of the third spacer layer, and the CsPbCl3 of the third emission layer into a tungsten boat of the thermal evaporation vacuum chamber system prior to the steps of depositing the respective layers;
• and
• (b) for each of the loaded CsPbI1.5Br1.5 of the first emission layer, the transparent polymer or the transparent metal of the second spacer layer, the CsPbBr3 of the second emission layer, the transparent polymer or the transparent metal of the third spacer layer, and the CsPbCl3 of the third emission layer, reducing a pressure within the thermal evaporation vacuum chamber system to about 10−4 mbar or less and increasing a current of the tungsten boat to about 17 amps or more to allow the respective layers within the tungsten boat to sequentially and separately evaporate toward the substrate thereby depositing:
• the evaporated CsPbI1.5Br1.5 of the first emission layer on the substrate to obtain a CsPbI1.5Br1.5 first emission layer film on the substrate,
• the evaporated transparent polymer or the evaporated transparent metal of the second spacer layer on the CsPbI1.5Br1.5 first emission layer film to obtain a transparent polymer or a transparent metal second spacer layer film on the CsPbI1.5Br1.5 first emission layer film,
• the evaporated CsPbBr3 of the second emission layer on the transparent polymer or the transparent metal second spacer layer film to obtain a CsPbBr3 second emission layer film on the transparent polymer or the transparent metal second spacer layer film,
• the evaporated transparent polymer or the evaporated transparent metal of the third spacer layer on the CsPbBr3 second emission layer film to obtain a transparent polymer or a transparent metal third spacer layer film on the CsPbBr3 second emission layer film, and
• the evaporated CsPbCl3 of the third emission layer on the transparent polymer or the transparent metal third spacer layer film to obtain a CsPbCl3 third emission layer film on the transparent polymer or the transparent metal third spacer layer film.