Multilayer electronic component

A multilayer electronic component comprising:

• a stack including a plurality of dielectric layers that are stacked together;
• a first inductor wound about a first axis orthogonal to a stacking direction of the plurality of dielectric layers;
• and
• a second inductor wound about a second axis orthogonal to the stacking direction of the plurality of dielectric layers, wherein
• the first inductor and the second inductor are disposed inside the stack and integrated with the stack,
• each of the first inductor and the second inductor includes a first through hole column, a second through hole column, and a first conductor layer portion connecting one end of the first through hole column and one end of the second through hole column,
• the first through hole column and the second through hole column of the first inductor are each constituted by two or more through holes connected in series to each other, the two or more through holes being formed in different dielectric layers of the plurality of dielectric layers,
• the first conductor layer portion includes a first conductor layer and a second conductor layer that are formed on two dielectric layers of the plurality of dielectric layers and connected in parallel to each other, the two dielectric layers being disposed at positions different from each other in the stacking direction,
• area of the first conductor layer is larger than area of the second conductor layer, and
• the first axis and the second axis are orthogonal to each other.