Multilayer electronic component

A multilayer electronic component comprising:

• a multilayer structure in which dielectric layers are stacked in a stack direction, the multilayer structure having a first surface and a second surface provided on respective sides in the stack direction;
• a first side-surface electrode provided on a side surface of the multilayer structure;
• an inductor provided in the multilayer structure;
• a plurality of capacitors provided between the inductor and the first surface;
• a via wiring line that penetrates through dielectric layers from a first dielectric layer to a second dielectric layer, and electrically connects a first end of the inductor and the first side surface electrode, the first dielectric layer being in contact with the inductor, the second dielectric layer being located closer to the first surface than all of the plurality of capacitors;
• a second side-surface electrode that is electrically connected to the first side-surface electrode through the inductor and the via wiring line and is provided on the side surface or another side surface of the multilayer structure, and
• a conductor pattern provided between adjacent dielectric layers between the all of the plurality of capacitors and the first surface, the conductor pattern electrically connecting the via wiring line and the first side-surface electrode.