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US 12,619,038 B2Granted
Approach to prevent plating at v-groove zone in photonics silicon during bumping or pillaring
AssigneeIntel Corporation
InventorSantosh Shaw
Life of this patent
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Abstract
Embodiments disclosed herein include electronic devices and methods of forming electronic devices. In an embodiment, an electronic device comprises a die. In an embodiment, the die comprises a semiconductor substrate, a bump field over the semiconductor substrate, and a V-groove into the semiconductor substrate, wherein the V-groove extends to an edge of the semiconductor substrate. In an embodiment, the V-groove is free from conductive material. In an embodiment, the electronic device further comprises an optical fiber inserted into the V-groove.
Claims8
An electronic device, comprising:
- a die, wherein the die comprises:
- a semiconductor substrate;
- a bump field over the semiconductor substrate;
- and
- a V-groove into the semiconductor substrate, wherein the V-groove extends to an edge of the semiconductor substrate, and wherein the V-groove is free from conductive material;
- an optical fiber inserted into the V-groove;
- and
- a spot size converter at an end of the V-groove away from the edge of the semiconductor substrate, the spot size converter intervening between the end of the V-groove and the bump field.
5 more elements
An electronic system, comprising:
- a board;
- a package substrate coupled to the board;
- a die coupled to the package substrate, wherein the die comprises:
- a semiconductor substrate;
- a bump field over the semiconductor substrate;
- and
- a V-groove into the semiconductor substrate, wherein the V-groove extends to an edge of the semiconductor substrate, and wherein the V-groove is free from conductive material;
- an optical fiber inserted into the V-groove;
- and
- a spot size converter at an end of the V-groove away from the edge of the semiconductor substrate, the spot size converter intervening between the end of the V-groove and the bump field.
7 more elements
Dependencies are inferred from the claim text.