Sensor array module for an advanced driver assistance system
AssigneeSemiconductor Components Industries, LLC
InventorMarek Hustava
Life of this patent
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Abstract
A smart ultrasonic integrated-circuit that allows at least one MEMS device to be combined with a piezoelectric transducer in a sensor array module. The sensor array module is capable of additional functionality for an advanced driver assistance system. For example, the MEMS device can add functionality because its wide bandwidth allows for simultaneous detection of audio signals and ultrasonic signals. Accordingly, the sensor array module may provide dual-mode (audio and ultrasonic) sensing in a single module. Additionally the size/cost of a MEMS device allows for the use of a two-dimensional array for receiving ultrasonic echoes which can add a dimension to the ultrasonic range detection for a vehicle.
Claims21
A smart ultrasonic integrated-circuit, comprising:
- a transmitter coupled to a piezoelectric transducer configured to transmit an ultrasonic-transmit-signal towards an obstacle;
- a first receiver configured to receive a first receive-signal from a first MEMS device, the first receive-signal including a first ultrasonic portion and a first audio portion;
- a second receiver configured to receive a second receive-signal from a second MEMS device, the second receive-signal including a second ultrasonic portion and a second audio portion;
- and
- a processor configured to:
- process the first ultrasonic portion of the first receive-signal and the second ultrasonic portion of the second receive-signal to determine two-dimensional range information for the obstacle;
- process the first audio portion of the first receive-signal and the second audio portion of the second receive-signal to determine audio information for a sound source;
- and
- output the two-dimensional range information and the audio information.
A smart ultrasonic integrated-circuit, comprising:
- a transmitter coupled to a piezoelectric transducer configured to transmit an ultrasonic-transmit-signal towards an obstacle;
- a first receiver configured to receive a first receive-signal from the piezoelectric transducer, the first receive-signal including a first ultrasonic-echo;
- a second receiver configured to receive a second receive-signal from a MEMS device, the second receive-signal including a second ultrasonic-echo and an audio signal;
- and
- a processor configured to:
- determine a two-dimensional range based on the first ultrasonic-echo and the second ultrasonic-echo;
- determine audio information based on the audio signal;
- and
- output the two-dimensional range and the audio information.
A non-transitory computer-readable medium storing instructions that, when executed by a processor of a smart ultrasonic integrated-circuit, cause the smart ultrasonic integrated-circuit to:
- transmit, via a transmitter coupled to a piezoelectric transducer, an ultrasonic-transmit-signal towards an obstacle;
- receive, via a first receiver, a first receive-signal from a first MEMS device, the first receive-signal including a first ultrasonic portion and a first audio portion;
- receive, via a second receiver, a second receive-signal from a second MEMS device, the second receive-signal including a second ultrasonic portion and a second audio portion;
- process the first ultrasonic portion of the first receive-signal and the second ultrasonic portion of the second receive-signal to determine two-dimensional range information for the obstacle;
- process the first audio portion of the first receive-signal and the second audio portion of the second receive-signal to determine audio information for a sound source;
- and
- output the two-dimensional range information and the audio information.
Dependencies are inferred from the claim text.