Back to results
US 12,618,142 B2Granted
Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorsTatsuo Hatano, Naoki Watanabe
Life of this patent
Estimating the term…
Abstract
A substrate processing apparatus includes: a tray provided in a vacuum processing container and having a recess that accommodates a target made of a low-melting-point material; a refrigerator that cools the tray; a substrate holder that holds a substrate; a reversal driver that reverses the position of the substrate holder upside down; and a rotation driver that rotates the substrate holder in a circumferential direction of the substrate.
Claims15
A substrate processing apparatus comprising:
- a tray provided in a vacuum processing container and having a recess that accommodates a first target;
- a first magnet disposed on a back surface of the tray;
- a target holder provided in the vacuum processing container, the target holder configured to hold a second target;
- a second magnet disposed on a back surface of the target holder;
- a magnet scanner configured to reciprocate the second magnet such that when the second target is determined to be sputtered, a position at which sputtered particles are emitted can be changed by reciprocating the second magnet;
- a refrigerator configured to cool the tray via an insulator positioned between the tray and a heat transfer member such that the first target is solidified;
- a first heater configured to heat the tray;
- a substrate holder configured to hold a substrate;
- a reversal driver configured to reverse a position of the substrate holder upside down;
- a rotation driver configured to rotate the substrate holder in a circumferential direction of the substrate;
- and
- a shielding plate having an opening,
- a controller configured to:
- heat the tray, via the first heater, such that a temperature is maintained at which the first target enters a liquid state;
- after the first target in a liquid state is introduced into the recess of the tray, evacuate an inside of the vacuum processing container;
- cool the first target, via the refrigerator, to a temperature sufficiently lower than a melting point of the first target;
- adsorb the substrate onto the substrate holder;
- rotate the substrate holder, via the reversal driver, to reverse the substrate holder upside down;
- rotate the shielding plate such that the opening is positioned facing the second target
- introduce a sputtering gas into the vacuum processing container and apply a voltage to the target holder to sputter the second target;
- rotate the shielding plate such that the opening is positioned facing the first target;
- introduce the sputtering gas into the vacuum processing container and apply a voltage to the tray to sputter the first target;
- wherein the shielding plate is configured to rotate such that when the opening of the shielding plate is positioned facing the first target, the second target is covered by the shielding plate, and when the opening of the shielding plate is positioned facing the second target, the first target is covered by the shielding plate,
- wherein the tray is provided to face upward, and the target holder is provided to be oblique with respect to a rotation axis of the substrate holder rotating in the circumferential direction.
21 more elements
A substrate processing method comprising:
- providing a substrate processing apparatus including:
- a tray provided in a vacuum processing container and having a recess that accommodates a first target,
- a first magnet disposed on a back surface of the tray;
- a target holder provided in the vacuum processing container, the target holder configured to hold a second target,
- a second magnet disposed on a back surface of the target holder;
- a magnet scanner configured to reciprocate the second magnet such that when the second target is determined to be sputtered, a position at which sputtered particles are emitted can be changed by reciprocating the second magnet,
- a refrigerator configured to cool the tray via an insulator positioned between the tray and a heat transfer member such that the first target is solidified,
- a substrate holder configured to hold a substrate,
- a first heater configured to heat the tray,
- a reversal driver configured to reverse a position of the substrate holder upside down,
- a rotation driver configured to rotate the substrate holder in a circumferential direction of the substrate, and
- a shielding plate having an opening,
- wherein the shielding plate is configured to rotate such that when the opening of the shielding plate is positioned facing the first target, the second target is covered by the shielding plate, and when the opening of the shielding plate is positioned facing the second target, the first target is covered by the shielding plate,
- wherein the tray is provided to face upward, and the target holder is provided to be holder rotating in the oblique with respect to a rotation axis of the substrate circumferential direction;
- and
- forming a film on the substrate by sputtering the first target in a state where the first target is cooled by the refrigerator.
13 more elements
Dependencies are inferred from the claim text.