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US 12,617,995 B2Granted
RF heat dissipation plastic, method for manufacturing RF heat dissipation plastic, and repeater cabinet using same
AssigneeAmogreentech Co., Ltd.
InventorJin Hyoung Lee
Life of this patent
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Abstract
An RF heat dissipation plastic including a polymer matrix comprising a polymer resin; and a first filler that is dispersed in the polymer matrix, and includes a high-strength filler, which is a polymer containing at least one hydroxy group in the repeating unit thereof, and an inorganic coating layer formed on at least a part of the surface of the high-strength filler. Therefore, the RF heat dissipation plastic has a low dielectric constant and excellent mechanical strength are simultaneously exhibited.
Claims10
An RF heat dissipation plastic, comprising:
- a polymer matrix comprising a polymer resin;
- a first filler that is dispersed in the polymer matrix and comprises a high-strength filler, which is comprised in an amount of 1 to 15 parts by weight based on 100 parts by weight of the polymer resin, is a cellulose-based filler including at least one hydroxy group and having an average cross-sectional diameter of 20 nm to 10 μm, and an inorganic coating layer formed on at least a part of the surface of the high-strength filler and having an average thickness of 10 to 20 nm, and the first filler comprises 100 to 200 parts by weight of the inorganic coating layer based on 100 parts by weight of the high-strength filler;
- and
- a second filler dispersed in the polymer matrix to improve heat dissipation characteristics in an amount of 50 to 150 parts by weight based on 100 parts by weight of the polymer resin, which is a graphite composite comprising a plate shape graphite, nanoparticles bonded to the surface of the graphite, and a catecholamine layer bonded to the surface of the nanoparticles bonded to the surface of the graphite, and a catecholamine layer bonded to the surface of the nanoparticles, and the second filler has an average particle diameter of 10 to 250 μm,
- wherein the RF heat dissipation plastic has a dielectric loss of 0.0005 to 0.0006 at 28 GHz.
2 more elements
A method for manufacturing an RF heat dissipation plastic, comprising:
- (1) manufacturing a first filler by treating at least a part of the surface of a high-strength filler, which is a cellulose-based filler including at least one hydroxy group and having an average cross-sectional diameter of 20 nm to 10 μm, with an inorganic coating precursor to form an inorganic coating layer having a thickness of 10 to 20 nm on at least part of the surface, and the first filler comprises 100 to 200 parts by weight of the inorganic coating layer based on 100 parts by weight of the high-strength filler;
- and
- (2) dispersing the first filler and a second filler in order to improve heat dissipation characteristics in a polymer resin, wherein the first filler is comprised in an amount of 1 to 15 parts by weight based on 100 parts by weight of the polymer resin and the second filler is comprised in an amount of 50 to 150 parts by weight based on 100 parts by weight of the polymer resin, and wherein the second filler is a graphite composite comprising a plate shape graphite nanoparticles bonded to the surface of the graphite, and a catecholamine layer bonded to the surface of the nanoparticles, and the second filler has an average particle diameter of 10 to 250 μm,
- and wherein the RF heat dissipation plastic has a dielectric loss of 0.0005 to 0.0006 at 28 GHz.
1 more element
Dependencies are inferred from the claim text.