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US 12,617,981 B2Granted
Pressure-sensitive adhesive sheet for semiconductor processing
AssigneeNitto Denko Corporation
InventorsJun Akiyama, Yuji Kato, Taiki Ueno
Life of this patent
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Abstract
Provided is a pressure-sensitive adhesive sheet for semiconductor processing having excellent solvent resistance. The pressure-sensitive adhesive sheet for semiconductor processing includes a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition containing a base polymer, and a base material. The pressure-sensitive adhesive composition has a swelling degree SA of 2.1 times or less when immersed in an N,N-dimethylpropionamide solution at 23° C. for 1 hour.
Claims7
A pressure-sensitive adhesive sheet for semiconductor processing, comprising:
- a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition containing a base polymer;
- and
- a base material,
- wherein the pressure-sensitive adhesive composition has a swelling degree SA of 2.1 times or less when immersed in an N,N-dimethylpropionamide solution at 23° C. for 1 hour,
- wherein the pressure-sensitive adhesive composition is a UV-curable pressure-sensitive adhesive, and
- wherein a content ratio of a cross-linking agent is in a range from 0.01 part by weight to 0.75 part by weight with respect to 100 parts by weight of the base polymer.
3 more elements
Dependencies are inferred from the claim text.