Semiconductor substrate cleaning method, processed semiconductor substrate manufacturing method, and composition for peeling

A processed semiconductor substrate production method comprising:

• producing a laminate having a semiconductor substrate, a support substrate, and an adhesive layer formed from an adhesive composition;
• processing the semiconductor substrate of the produced laminate;
• separating the semiconductor substrate and the adhesive layer from the support substrate;
• and
• removing the adhesive layer on the semiconductor substrate by use of a remover composition, wherein
• the remover composition contains a solvent but no salt;
• and
• the solvent includes an organic solvent represented by formula (L):
• wherein each of L1 and L2 represents a C1 to C6 alkyl group, and the sum of the number of carbon atoms of the alkyl group L1 and that of the alkyl group L2 is 6 or less in an amount of 80 mass % or more.