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US 12,617,942 B1Granted
Resin composition and applications of the same
AssigneeTaiwan Union Technology Corporation
InventorTsung-Hsien Lin
Life of this patent
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Abstract
A resin composition is provided. The resin composition comprises (A) an epoxy resin, (B) a dicyclopentadiene-based phenol resin, and (C) a first filler. The first filler is a boehmite filler having a D50 diameter ranging from 1 μm to 4 μm.
Claims15
A resin composition, comprising:
- (A) an epoxy resin;
- (B) a dicyclopentadiene-based phenol resin;
- and
- (C) a first filler, which is a boehmite filler having a D50 diameter ranging from 1 μm to 4 μm,
- wherein the dicyclopentadiene-based phenol resin (B) has a structure represented by the following formula (I):
- wherein,
- n is an integer of 2 to 50;
- Ph is independently a hydroxyl-containing group derived from an aromatic phenol compound;
- and
- D has a structure represented by the following formula (II), and each D is the same or different:
7 more elements
Dependencies are inferred from the claim text.