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US 12,617,930 B2Granted
Resin composition, molded body using same and method for producing resin composition
AssigneeKuraray Co., Ltd.
InventorsShuichi Sunaga, Yuta Matsushita, Wenjie Lu
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Abstract
A resin composition comprising: a resin (A) having 30 mol % or more of a structural unit represented by a formula (1) below, and a boron compound (B), the boron compound (B) containing a boron element in an amount of 0.01 to 2,000 μmol per gram of the resin (A).
Claims13
A resin composition comprising:
- a resin (A) comprising at least 30 mol % of a structural unit represented by the following formula (1), and
- a boron compound (B),
- wherein the boron compound (B) comprises from 0.01 μmol to 2,000 μmol of a boron element per gram of the resin (A)
A method for producing a resin composition, the method comprising:
- bringing a resin (A) comprising at least 30 mol % of a structural unit represented by the following formula (1), a boron compound (B) and water into contact with each other
Dependencies are inferred from the claim text.