Resin composition for stereolithography

A resin composition for stereolithography, comprising:

• a urethanized (meth)acrylic compound (A), a (meth)acrylate compound (B) containing no urethane bond, a photopolymerization initiator (C), and 0.1 to 100 parts by mass relative to 100 parts by mass of the photopolymerization initiator (C) of a polymerization inhibitor (D),
• the urethanized (meth)acrylic compound (A) being a urethanized (meth)acrylic compound (A-1) having a polymer structure,
• the urethanized (meth)acrylic compound (A-1) having a polymer structure having a weight-average molecular weight of less than 1,000,
• the (meth)acrylate compound (B) containing no urethane bond comprising at least one selected from the group consisting of a (meth)acrylate compound (b-I) represented by the following general formula (I), and a (meth)acrylate compound (b-II) represented by the following general formula (II):
• wherein R1 and R2 are each independently a group represented by the following general formula (i), or a group represented by the following general formula (ii), and X is a C1 to C6 divalent hydrocarbon group, or an oxygen atom,
• wherein R3 and R5 are each independently a C1 to C10 divalent hydrocarbon group, R4 and R6 are each independently a hydrogen atom or a methyl group, and k and l are each independently an integer of 0 to 6,
• and wherein said resin composition for stereolithography further comprises a urethanized (meth)acrylic compound (A-2) having no polymer structure comprising 2,2,4-trimethylhexamethylene bis(2-carbamoyloxyethyl)dimethacrylate and/or N,N′-(2,2,4-trimethylhexamethylene)bis[2-(aminocarboxy)propane-1,3-diol]tetramethacrylate.